The Electron Beam Evaporator is a unique machine in which a target anode is bombarded with an electron beam that is generated by a heated tungsten filament under high vacuum.

In this way, the source metal is heated above its boiling or sublimation point and evaporated in order to form a thin film on the surface of the substrate. The Electron Beam Evaporator has the ability to add greater amount of the energy into the source material and hence it can be used for metals and ceramics with high boiling points for their thin film deposition.

This thin film deposition technique is applied in semiconductor industries to integrate electronic devices with metal contacts. This technique is also used for in coatings applicable to aerospace industry.

The Electron Beam Evaporator works almost similar to the Thermal Evaporator, but the particular method of EBE is more result oriented as it generates more energy in lesser time and hence is beneficial for industrial usage.

This is most commonly used for the evaporation of different metals and oxides such as aluminum, titanium, gold, silver, chromium, Al2O3, HfO2, SiO2, etc.

The EBE has the following applications:

• Oxides and nitrate coatings
• Coating of metals called metallic coatings
• Epitaxial Coating
• manufacture and synthesis of the thin films for chip metallization and anti-reflective coatings for optical components

One of the most interesting things about the Electron Beam Evaporator is that the machine is designed and customized in such a way that it makes the integration easy when it comes to dealing with a variety of other deposition techniques that include laser and sputtering sources.