Sputtering System

Product Description

1. 1. High-Vacuum Stainless Steel Deposition Chamber
      – The vacuum chamber is constructed from 304L stainless steel and engineered to sustain a high-vacuum environment.
      – The vacuum chamber is subjected to leak testing with helium at a minimum of 10⁻⁹ mbar-L/sec.
      – The baseline pressure for a properly conditioned, clean, dry, and evacuated chamber is less than 5 × 10⁻⁷ Torr.
      – The vacuum chamber contains ConFlat ports and flanges, which are predominantly sealed with copper gaskets. In some locations, flanges are fitted with Viton gaskets to facilitate easier removal and sealing.
      – Spare ports are supplied and will be sealed with blank flanges.
      – The design provides seamless and rapid access to any section within the internal volume of the chamber.
      – Repetitive batch processing involving multiple substrates for depositions.
      – Enables easy loading and unloading of sample holders and target materials.
      – Suitable flange ports are designated for the turbo molecular vacuum pump, sputter gun assembly, vacuum gauge, sample holder, windows, as well as access to sample loading and accessories.

1. 2. System Framework
      – A clean room-grade frame designed for mounting the chamber.
      – Contains rack mount panels that hold all system electronics and the power distribution unit.
      – Includes caster wheels and leveling pads.

1. 3. Chamber Pumping
      – Includes an integrated Turbo Pump.
      – Includes a mechanical dry pump serving as a backing pump to achieve a rough vacuum.
      – Includes all relevant hardware, vacuum plumbing, and valves necessary for pumping and venting operations.
      – Maximum reliability within a compact design.
      – High pumping speed and maximum compression for all gases.
      – Integrated drive electronics, appropriate for industrial settings.
      – Continuous monitoring of operational data.

1. 4. Dry Mechanical Pump
      – Oil-free scroll pump to prevent any hydrocarbon oil fumes that could contaminate the process.
      – Oil-free maintenance for the pump.

1. 5. Gas Flow Control for Process Stabilization and Pressure Optimization
      – The combination of gas flow and turbo pump speed can be utilized for the optimization of sputtering process pressure. Blue Wave Semiconductors offers gas flow meters (Please see the specification table).

1. 6. Vacuum Gauges
      – Includes a full range vacuum gauge and a process vacuum gauge.
      – The full range gauge measures from atmospheric pressure to 10⁻⁹ Torr.
      – The process gauge enables accurate pressure measurements during operation.
      – Both gauges contain a digital pressure readout.
      – Includes all mounting hardware and cables.
      – Easy to operate and clean, resisting metal and oxide contamination over extended use.

1. 7. Sputtering Gun(s) and Power Supply(s)
      – Contains customer specified Sputtering Gun(s). (Please see the specification table)
      – Contains power supply(s): RF and/or DC Power Supply. (Please see the specification table)
      – Generator, Matching Network, and Controller Included.
      – Analog or Serial Interface
      – Auto/Manual Operation
      – Water flow interlock included.
      – Shutter for pre-sputter process.

1. 8. Substrate Mounting and Rotation
      – Substrates are affixed to the platen using clips.
      – The substrate rotates at 10 RPM. (Optional rotation speed available)
      – Samples are manually loaded through the chamber door.
      – Substrate heater option available.

1. 9. Water Cooling
      – Components that necessitate water cooling will be directed to a shared flow indicator located near the rear of the assembly. The customer will be responsible for supplying cooling water (inlet/outlet) to the rear bulkhead fitting.
      – A water flow sensor for the interlock will be included with this assembly. The customer is responsible for providing the applicable components, which may include a chiller, compressors, controllers, tubing, clamps, etc.

1. 10. Semi-Automated Operation
       – The system can be operated entirely in manual mode. Additionally, it can function in semi-automated mode utilizing recipe-based programming. A Windows-based computer equipped with software for real-time data display, monitoring, and logging is provided for ease of use.

Optional upgrades

OP-1.   Additional Gas/Mass Flow Controller
– Contact Blue Wave for additional mass flow controller selection.

OP-2.   Rotation Speed Adjustment
– Enables the substrate holder to operate at variable speeds.

OP-3.   Substrate Heater and Temperature Controller
– The substrate holder may be upgraded to incorporate a Blue Wave brand Inconel substrate heater for precise substrate temperature regulation and monitoring.
– The substrate heater operates at a maximum temperature of 600˚C, with a temperature uniformity of within 10%. Additionally, it includes a stainless-steel shield equipped with six 4-40 tapped holes for sample clamping.
– The substrate heater element is sealed against exposure to reactive gases and plasma deposition.
– Includes a Blue Wave temperature controller that precisely manages the substrate heater temperature and provides it with power while providing the temperature readings.

OP-4.   Z-Travel for Substrate Fixture:
– 2-inch in-situ vacuum movement of the substrate.
– Contains a digital display of the distance moved.

OP-5.   Load Lock Wafer Transfer Mechanism:
– A chamber isolated with a gate valve that allows for in-situ sample transfer.
– Contains an additional vacuum gauge for load lock pressure readings.
– Contains a sample loading arm.

OP-6 Add Pulse Laser Deposition, Electron Beam Evaporator, or Thermal Evaporator:
– The sputtering chamber can integrate with other CVD systems. Contact Blue Wave Semiconductor for more information.