Bell Jar Thermal Evaporator System
Blue Wave Semiconductors offers the Bell Jar Thermal Evaporator System, a compact and cost‑effective platform engineered for high‑quality physical vapor deposition of thin films. Designed with a Pyrex glass bell‑jar vacuum chamber, this system supports one standard evaporation source with the option to integrate a second source for expanded material capabilities. The chamber accommodates multiple small substrates as well as single wafers up to 4 inches, secured with precision clamping for stable deposition conditions.
The Thermal Evaporator incorporates a robust vacuum architecture featuring a turbo‑molecular pumping system backed by a mechanical pump, enabling an ultimate base pressure better than 3 × 10⁻⁶ Torr. This performance makes the system well-suited to research environments that require clean, controlled deposition conditions. It is purpose‑built for graduate and undergraduate laboratories, high‑level R&D programs, industrial prototyping, and the development of advanced thin‑film materials. With the Thermal Evaporator, precise thin-film deposition and material development are enabled, with customizable support for machine learning, automation, and integration with artificial intelligence systems.
Applications
1. Optical Transparent Coatings
2. Oxide and Nitride Coatings (MnO₃, TiO₂, Al₂O₃)
3. Die-electric Coatings (Low and High-k)
4. Metallic Coatings (Al, Au, Pt, Ag, Cu, Ti, Cr, etc.)
5. Multilayer thin films
6. Organic OLEDs coatings
- Description
- Specification
- Brochure
- Photos
- Videos
Product Description
1. High-Vacuum Deposition Chamber
– The chamber is constructed from PYREX glass with a 16-inch diameter and 20-inch height, providing a see-through high‑vacuum environment.
– The system achieves a base pressure better than 3×10⁻⁶ Torr when clean, dry, and properly conditioned.
– Designed for easy and fast access to the full internal chamber volume, enabling efficient workflow during deposition processes.
– Supports repetitive batch processing with simple loading and unloading of substrates, evaporation materials, and sources, while allowing clear visual monitoring during operation.
– Equipped with well‑designed flange ports for the turbo‑molecular pump, evaporation assembly, vacuum gauge, substrate holder, sample‑loading access, accessories, and optional substrate heating.
– Engineered for thin‑film research, prototype device fabrication, and deposition of metals, optical coatings, selective oxides, and polymer materials.
2. System Framework
– A robust clean room-grade frame designed for holding the chamber and system components.
– Integrated rackmount mounting for electronics, power distribution, and control systems.
– Equipped with mobility and leveling features for easy installation and adjustment.
3. Chamber Pumping:
– Includes an oil mechanical pump capable of achieving high vacuum levels better than 9×10⁻³ Torr.
– A turbo pump will further pump down the chamber, achieving high vacuum levels better than 3×10⁻⁶ Torr.
– Includes all relevant hardware, vacuum plumbing, and valves necessary for pumping and venting operations.
– Compact, efficient design optimized for stability and long-term use.
4. Oil Mechanical Pump:
– High-performance rotary vane oil pump optimized for process stability.
– Equipped with an isolation valve to protect against back-streaming.
5. Vacuum Gauge
– Utilizes a full‑range vacuum gauge capable of measuring from atmospheric pressure down to 1×10⁻⁸ Torr
– The gauge contains a digital pressure readout.
– Includes all mounting hardware and cables.
– Easy to operate and clean, resisting metal and oxide contamination over extended use.
7. Thermal Evaporation Source
– A high‑current evaporation source assembly equipped with tungsten filament and robust feedthroughs for stable deposition performance.
– A dedicated power supply designed to deliver the required current for reliable source heating.
– A manually operated shutter positioned over the substrate to control deposition exposure.
– Integrated shielding to minimize cross‑contamination during evaporation processes.
8. Substrate Holder/Adjustment
– A mechanically clamped substrate holder designed to support wafers up to 4 inches in diameter securely.
– Operates at room temperature with an option to integrate a substrate heater for expanded process capability.
– Allows quick and simple clamping and removal of samples for efficient workflow.
10. Computer Control
– Includes a computer equipped with custom software, which includes, but is not limited to:
• Vacuum measurements
• Power control and monitoring
• Thickness measurement (If selected)
• Adjustable safety interlocks
Additional Options Available
OP-1. Dry Pump
• Contact Blue Wave to ask if this option is required.
OP-2. Substrate Heater and Temperature Controller
• The substrate holder may be upgraded to incorporate a Blue Wave brand Inconel substrate heater for precise substrate temperature regulation and monitoring.
• The substrate heater operates at a maximum temperature of 600˚C, with a temperature uniformity of within 10%. Additionally, it includes a stainless-steel shield equipped with six 4-40 tapped holes for sample clamping.
• The substrate heater element is sealed against exposure to reactive gases and plasma deposition.
• Includes a Blue Wave temperature controller that precisely manages the substrate heater temperature and provides it with power while providing the temperature readings.
OP-3. System Gas Flow
• The system may be integrated with a mass flow controller (MFC) and needle valve to flow gas into the chamber during deposition.
OP-4. Quartz Monitor Crystals for In-Situ Thickness Measuring
• The system integrates high‑precision quartz crystal monitoring for accurate in‑situ film thickness measurement and real‑time deposition rate control.
• The quartz crystal sensors are industry‑proven for stability, accuracy, and long‑term reliability across a wide range of thin‑film materials and processes.
• A single manually shuttered crystal sensor is positioned near the substrate to ensure precise, localized measurement during deposition.
Product Specification
| Specification | Parameter |
|---|---|
| Vacuum With Turbo Pump | 5 × 10-7 Torr |
| Temperature Range | 500 – 2500 °C |
| System Input Power | One 220 VAC 1Φ power source. (Customizable) |
| Power Supply | 5 – 10 kW |
| Vacuum Pump | Oil Pump |
| Turbo Pump Speed (If applicable) | 90 L/s |
| Mechanical Pump Speed (If applicable) | 15 m3/hr |
| Cooling | Water Cooling, Air Cooling |
| Vacuum Seals | Elastomer O-rings, Copper Gaskets, Sealing Ring |
| Deposition Area | 0.5 to 2” Diameter |
| Deposition Rate | |
| Substrate Holder | Molybdenum (Mo) |
| System Chamber | Quartz Bell Jar |
| Interlock Control | – Water Flow – Chamber Temperature – Power Deviation – Emergency Stop |
| System Size | – Width: 2 ft – Depth: 2 ft – Height: 3.5 ft |
Brochure
We’re updating the contents on this page, please check back again soon!
Photos

Videos
We’re updating the contents on this page, please check back again soon!




