Sputtering System

The BWS Sputtering System is a fully customizable state-of-the-art physical vapor deposition system designed for the synthesis of high quality thin films and thin film research.

The Sputtering System offers a variety of built-in and custom features such as: optimized 3-gun flange, substrate heater, pressure adjustment, and is designed for easy integration with a variety of other deposition techniques and sources such as: PLD, Thermal Evaporation & CVD, E-beam, and more.

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Product Description

Applications

  • Optical Transparent Coatings
  • Oxide and Nitride Coatings
  • Die-electric (low or high-k) Coatings
  • Metallic Coatings
  • Multilayer thin films and devices

Features

  • Customizable stainless steel reactor chamber
  • Compact PVD system design for easy transport

Custom Options Available:

  • Custom flange for up to 3 sputtering gun design for quick changing of the deposition material 
  • BWS rotating substrate heater capable of reaching temperatures up to 800°C (900°C for the fixed or non-rotatable design)
  • Optional linear motion z-stage for vertical axis adjustment of the substrate
  • Optional load lock with gate valve and transfer arm for easy sample removal
  • Turbo/Cryopump
  • Optional automated system control via LabView software
  • 10″ quick access door for sample transfer

Specifications

Process Chamber

  • Customizable stainless steel chamber
  • Multiple (six 8″ and 18″ CF and one 6″ CF) flange ports for mounting optical windows and other accessories
  • Base pressure compatibility better than 5E-2 Torr
  • Capable of reaching ultra high vacuum(UHV) levels greater than 5E-7 Torr with cryopump addition
  • Maximum baking temperature of 300°C when fitted with copper baskets
  • Electro-polished inside and out for enhanced mechanical properties and corrosion protection

Gas Flow System

  • Full-scale flow ranges from 10 sccm up to 1000 sccm
  • Repeatable flow control to as low as 0.2 sccm
  • Built-in gas shut-off valves for over-pressure safety
  • 1% F.S. accuracy and 1% of reading for most flow ranges

Pressure Management System

  • 350 L/sec Molecular turbopump for high vacuum levels up to 10E-8Torr
  • Dry or hydrocarbon roughing pump for base vacuum levels of 10E-2Torr
  • High accuracy, full –range pressure gauge with digital display
  • Upstream or downstream process pressure control options
  • Built-in pressure set-point interlock for over-pressure safety protection

Substrate Temperature Control System

  • Versatile 2″ diameter closed–loop substrate heater (temperature max 850°C and temperature non-uniformity across the wafer within 5-10%)
  • Eurotherm 2416 temperature controller for substrate heating with auto programming and manual modes

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